| The Vacuum Chamber Module: |
| Multiport stainless steel UHV analysis chamber including large view port, flanges and fittings. All ports are conflat type, UHV.
The ultimate chamber vacuum is < 2 x 10-9 mbar after bake out. |
| TOF-SIMS ion analyser. Time of flight mass spectrometer |
| for enhanced static TOF-SIMS capability with hyperspectral imaging.
Including ion extraction column matched to reflectron TOF with counting electronics High efficiency, on-axis, collection optics |
| Mass Range: |
6 -10,000 amu standard. |
| Mass resolution |
1500 |
| Sensitivity |
>100 kcps / nA (Al target, 100 pA 3 keV Ar) |
- SIMS Quadrupole ion analyser.
|
| Mass Range: |
510 amu standard.
300 amu and 1000 amu mass ranges optional. |
| Resolution: |
5% valley between adjacent peaks of equal height throughout the mass range. |
| Detector: |
Ion Counting detector, positive and negative ion detection, 4 kV post acceleration for positive ions. |
| Detection Range |
1 : 107 |
| Maximum count rate: |
107 counts per second. |
| Minimum count rate: |
1 count per second. |
| Sensitivity: |
> 1 x 106 c/s per nanoamp (5 keV Ar, primary ion detecting Al+ from Al target at 20 mm working distance, 300 amu system). |
| Energy Filter |
Energy Filter
300 off axis injection. |
| Ion Source |
Integral SNMS ion source
Electron impact 4 – 150 eV
Suitable for residual gas analysis – RGA. |
| Mass Filter: |
3 stages each of 4 poles. |
| Pole diameter: |
9.0 mm – 1000 Series high performance system. |
| Bake out Temperature: |
250°C. |
- IG20 Ion Gun specification
|
| Ion Beam: |
Energy |
0.5 to 5.0 keV |
|
Spot diameter |
50 microns for imaging
100 microns for depth profiling |
|
Current |
0.1 to 600 nA |
|
Species |
Oxygen or inert gases |
|
Deflection Field |
+/- 4 mm |
| Ion Source: |
Electron Impact |
Twin Filament |
|
Electron Emission |
0 to 20 mA |
|
Electron Energy |
0 to 100 volts |
| Ion Column: |
Condenser |
3 element lens |
|
Objective |
3 element lens |
|
Alignment |
Independent X and Y alignment plates |
|
Scan Deflection |
Independent X and Y deflection plates |
|
Fast Neutral Dump |
3 degree bend in the ion column |
|
Beam blanking |
Single deflector plate |
| Deflection Amplifiers: |
Minimum Sweep Time: |
64 µs |
|
Flyback Time: |
15 µs |
| Beam Blanking: |
Rise Time: |
3 µs |
|
Fall Time: |
3 µs |
| Mounting Port DN-35-CF (2.75″ OD) Conflat type |
|
Column Tip to Mounting Flange Distance: |
282.5 mm |
|
Column Tip to Sample Working Distance: |
20 to 50 mm |
| Mechanical Adjustment: |
Mechanical Spot Alignment : |
+/- 3 mm |
| IG5C Ion Gun Specification |
|
|
| Ion Beam |
|
|
|
Species Energy |
Caesium
0.5 to 5.0 keV |
|
Spot diameter |
20 microns minimum
80 µm typical |
|
Deflection Field |
+/- 4 mm |
|
Current |
0.1 to 150 nA |
|
Etch rate |
Maximum 30 nm/min for a silicon target |
| Ion Source |
|
Thermal decomposition surface Ionisation. Typically 10-20 W |
| Type |
|
|
| Ion Column |
|
3 element lens
Independent X and Y alignment plates for upper and lower column |
| Objective (Focus 2) |
|
Independent X and Y deflection plates |
| Alignment |
|
Double bend before objective lens |
| Deflection / Scan |
|
Single deflector plate after condenser |
| Beam blanking |
|
|
| Mounting |
|
DN-35-CF (2.75″ OD) Conflat type |
| Port |
|
35 mm minimum internal diameter |
| Port Clearance |
|
|
| Column Tip to Mounting |
|
|
| Flange Distance |
|
200 mm |
| Column Tip to Sample |
|
|
| Working Distance |
|
10 to 50 mm (10 – 20 mm for small spot applications) |
| Differential Pumping |
|
80 l/s turbomolecular pump set included |
| Bakeout |
|
|
| Maximum Recommended |
|
200°C |
| Temperature |
|
|
| Deflection Amplifiers |
|
|
|
Minimum |
64 µs |
|
Sweep Time |
|
|
Flyback Time |
15 µs |
| Beam Blanking |
|
|
|
Rise Time |
3 µs |
|
Fall Time |
3 µs |
| Displays |
PC based control |
Ion Energy, Condenser Lens, Objective Lens, Heater Current,Upper X-Align, Upper Y-Align, Lower X-Align, Lower Y-Align X-Deflection, Y-Deflection, X-Scan Amplitude, Y Scan Amplitude. |
|
Diagnostics /measurement |
Built in diagnostic line scan (X and Y), including supplies for electron suppressed beam current measurement and spotshape, and (incorporated electrometer displays beam current profile on PC). A simple line flyback raster generator is also included. |
|
Controls |
Control of all beam steering plates, scan amplitudes, offsets and lenses with settings saved to PC for future recall. |
|
External inputs |
The control unit accepts an external scan input. A gain control is provided to optimise amplification of the scan signal.
External target bias input (max 350 V) that is switched via the beam diagnostics control. |
| Power Requirements |
|
240/220 V, 120/110 V, 50/60 Hz, 0.25 kVA |
| Dimensions |
|
|
|
Control Unit |
311 mm (12.25″) height, 343 mm (13.5″) deep, 19″ Rack Mounting. |
|
Beam steering |
Mounts directly to the ion gun |
|
module |
63 mm (2.5″) x 127 mm (5.0″) x 368 mm (14.5″) length |
Blog
Tin tức & Sự kiện
Văn hóa doanh nghiệp
Video
Dự án tiêu biểu
Review ToF-qSIMS Workstation
Chưa có đánh giá nào.