Creative https://demo9.thuythu.vn/dx Fri, 08 May 2026 04:38:20 +0000 en-US hourly 1 https://wordpress.org/?v=6.5 https://demo9.thuythu.vn/dx/wp-content/uploads/2024/03/Du-an-moi-13.png Creative https://demo9.thuythu.vn/dx 32 32 Germany Aims to Boost Semiconductor Production with European Chips Act Support https://demo9.thuythu.vn/dx/germany-aims-to-boost-semiconductor-production-with-european-chips-act-support/ https://demo9.thuythu.vn/dx/germany-aims-to-boost-semiconductor-production-with-european-chips-act-support/#respond Tue, 26 Mar 2024 08:19:54 +0000 https://demo9.thuythu.vn/dx/?p=799 Germany, known as Europe’s industrial powerhouse, is gearing up to establish itself as a prominent player in semiconductor production. The European Union’s recent enactment of the European Chips Act aims to double semiconductor fab capacity by 2030. Germany plans to utilize the €43 billion Chips Act subsidy and native incentives to attract a significant portion of this capacity to its borders.

Driven by recent supply chain disruptions and concerns over the vulnerability of Asian electronics supply chains, both the U.S. and Europe are pushing for diversified supply sources. Europe, currently providing 10% of global semiconductors, seeks to increase this to 20% by 2030.

Germany, already a key semiconductor player, hosts one-third of Europe’s semiconductor production, centered in Saxony. TSMC’s €10 billion facility plans in Dresden highlight Germany’s involvement. Intel’s record-breaking €30 billion investment for two new fabs in Magdeburg and TSMC’s €10 billion commitment, supported by investments from Bosch, Infineon, and NXP, underscore the nation’s growing semiconductor focus.

Other major investments include GlobalFoundries’ capacity expansion, Wolfspeed’s cutting-edge SiC fab in Saarland, and Littelfuse’s acquisition of a fab in Dortmund. However, despite these efforts, Germany faces a shortage of 62,000 skilled workers in the chip industry. Addressing this labor shortage is vital to maximize the potential of these burgeoning semiconductor initiatives.

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Revolutionizing Computer Chip Performance: The Discovery of Re6Se8Cl2 Superatomic Semiconductor https://demo9.thuythu.vn/dx/revolutionizing-computer-chip-performance-the-discovery-of-re6se8cl2-superatomic-semiconductor/ https://demo9.thuythu.vn/dx/revolutionizing-computer-chip-performance-the-discovery-of-re6se8cl2-superatomic-semiconductor/#respond Tue, 26 Mar 2024 08:19:21 +0000 https://demo9.thuythu.vn/dx/?p=795 A groundbreaking superatomic semiconductor, Re6Se8Cl2, has shattered speed records, enabling particles to travel 100 to 1000 times faster than electrons in silicon chips. This discovery could revolutionize computer chip performance, potentially creating processors hundreds or thousands of times swifter than current technology.

Traditionally, silicon chip transistors rely on electron flow for data transmission, but electron movement leads to energy wastage and data slowdown due to scattering. Researchers at Columbia University uncovered a new semiconductor, Re6Se8Cl2, composed of rhenium, selenium, and chlorine. Despite excitons moving slower than electrons in silicon, they travel in straight paths, covering distances more efficiently.

Implementing excitons in transistors using this material could accelerate data transmission speeds significantly, potentially reaching hundreds of gigahertz or even terahertz. However, practical application remains years away due to the need to refine manufacturing techniques for this new material. Rhenium’s rarity, unlike abundant silicon, may limit its use to specialized applications like spacecraft and quantum computers.

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Global Semiconductor Sales Show Modest Monthly Rise Amid Yearly Decline: SIA Report https://demo9.thuythu.vn/dx/global-semiconductor-sales-show-modest-monthly-rise-amid-yearly-decline-sia-report/ https://demo9.thuythu.vn/dx/global-semiconductor-sales-show-modest-monthly-rise-amid-yearly-decline-sia-report/#respond Tue, 26 Mar 2024 08:18:47 +0000 https://demo9.thuythu.vn/dx/?p=792 The Semiconductor Industry Association (SIA) disclosed a 1.9% rise in global semiconductor sales for September 2023 compared to August 2023, yet experienced a 4.5% decline versus September 2022. The third quarter of 2023 witnessed global semiconductor sales totaling $134.7 billion, marking a 6.3% increase from the previous quarter but down 4.5% from the same period in 2022. These figures, calculated through a three-month moving average by the World Semiconductor Trade Statistics (WSTS), were released by SIA, representing 99% of the U.S. semiconductor industry’s revenue and nearly two-thirds of non-U.S. chip firms.

John Neuffer, SIA’s president and CEO, highlighted the seventh consecutive monthly increase, underscoring the positive trend in the chip market. He emphasized the enduring strength in semiconductor demand, driving innovation in various industries and fostering future transformative technologies.

Regionally, Asia Pacific/All Other (3.4%), Europe (3.0%), the Americas (2.4%), and China (0.5%) witnessed month-to-month sales growth, while Japan experienced a slight decrease (-0.2%). On a yearly basis, Europe showed an increase (6.7%), while the Americas (-2.0%), Japan (-3.6%), Asia Pacific/All Other (-5.6%), and China (-9.4%) faced declines.

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India and European Union Strengthen Semiconductor Ties with MoU Signing https://demo9.thuythu.vn/dx/india-and-european-union-strengthen-semiconductor-ties-with-mou-signing/ https://demo9.thuythu.vn/dx/india-and-european-union-strengthen-semiconductor-ties-with-mou-signing/#respond Tue, 26 Mar 2024 08:17:11 +0000 https://demo9.thuythu.vn/dx/?p=785 India and the European Union (EU) inked an MoU during the virtual second India-EU Trade and Technology Council (TTC) meeting, aiming to bolster semiconductor ties. This pact focuses on enhancing collaboration in the semiconductor ecosystem, enabling investments, joint ventures, and technological partnerships, including manufacturing ventures.

Aligned with India’s plan to offer $10 billion incentives for domestic chip manufacturing, the MoU emphasizes cooperation in semiconductor ecosystems, supply chains, and innovation. The TTC session assessed progress in high-performance computing, digital infrastructure, EV batteries, supply chain resilience, and FDI screening.

The TTC serves to deepen strategic engagement on trade and technology, marking the second such mechanism for the EU after the U.S. Both parties aim to leverage working groups for information exchange, best practices, and joint efforts in semiconductor research, industry skills, and subsidies.

The agreement promotes collaboration in research, development, and innovation in semiconductor technologies, encompassing advanced packaging, design, and raw materials. Additionally, it seeks to involve industry stakeholders and private sectors from both regions. The initial meeting on the semiconductor ecosystem is slated within three months of the MoU signing.

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Semiconductor Industry Association (SIA) Responds to Advancement of U.S.-Taiwan Tax Legislation https://demo9.thuythu.vn/dx/semiconductor-industry-association-sia-responds-to-advancement-of-u-s-taiwan-tax-legislation/ https://demo9.thuythu.vn/dx/semiconductor-industry-association-sia-responds-to-advancement-of-u-s-taiwan-tax-legislation/#respond Tue, 26 Mar 2024 08:16:31 +0000 https://demo9.thuythu.vn/dx/?p=779 SIA’s Statement on U.S.-Taiwan Tax Legislation Advancement

The Semiconductor Industry Association (SIA) responded to recent congressional action aimed at addressing double taxation and other tax-related issues between the U.S. and Taiwan. David Isaacs, the vice president of government affairs at SIA, conveyed the association’s stance.

Acknowledging the efforts of Senate Finance Committee Chair Wyden (D-Ore.) and Ranking Member Crapo (R-Idaho), Senate Foreign Relations Committee Chair Cardin (D-Md.) and Ranking Member Risch (R-Idaho), and House Ways and Means Committee Chair Smith (R-Mo.) and Ranking Member Neal (D-Mass.), SIA appreciates their work in paving the way to resolve pressing tax matters between the two nations.

The recent unanimous approval by the House Ways and Means Committee is viewed as a positive stride. It demonstrates a collective commitment to addressing double taxation concerns and reducing trade barriers between the U.S. and Taiwan.

SIA calls upon the House and Senate to swiftly pass this crucial legislation. Emphasizing the potential benefits for semiconductor companies in both nations, the passage is seen as instrumental in supporting the substantial investments in the U.S. semiconductor industry, particularly following the CHIPS and Science Act. Establishing a tax agreement between the U.S. and Taiwan is deemed a fundamental aspect for the success of this new law.

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Japan’s Toshiba and ROHM Partner to Boost Silicon and SiC Power Device Manufacturing https://demo9.thuythu.vn/dx/japans-toshiba-and-rohm-partner-to-boost-silicon-and-sic-power-device-manufacturing/ https://demo9.thuythu.vn/dx/japans-toshiba-and-rohm-partner-to-boost-silicon-and-sic-power-device-manufacturing/#respond Tue, 26 Mar 2024 08:15:28 +0000 https://demo9.thuythu.vn/dx/?p=775 Toshiba and ROHM announced a collaborative effort endorsed by Japan’s Ministry of Economy, Trade and Industry (METI) to escalate silicon and SiC power device manufacturing. This partnership responds to escalating demand across electronic applications, notably in carbon-neutral initiatives, electric vehicles, and industry.

ROHM anticipates wide adoption of its latest SiC MOSFETs in electric vehicles and industry, investing significantly to augment SiC production capacity and meet market demands. Simultaneously, Toshiba, a stalwart in silicon power devices, accelerates investments after launching a 300mm wafer line last year. It aims to expand SiC power devices for automotive, power transmission, and distribution applications, leveraging its railway vehicle expertise.

The collaboration’s support, up to JPY129.4 billion, of the total JPY388.3 billion investment, illustrates their commitment. ROHM invests JPY289.2 billion in SiC power devices and SiC wafer production at LAPIS Semiconductor Co Ltd’s Miyazaki Plant No.2, while Toshiba commits JPY99.1 billion to Kaga Toshiba Electronics Corp’s silicon power device manufacturing.

Beyond bolstering production, this collaboration aims to fortify Japan’s semiconductor supply chains, enhancing global competitiveness and resilience in semiconductor manufacturing.

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Tata Group Plans Rs 40,000 Crore Semiconductor Plant in Assam https://demo9.thuythu.vn/dx/tata-group-plans-rs-40000-crore-semiconductor-plant-in-assam/ https://demo9.thuythu.vn/dx/tata-group-plans-rs-40000-crore-semiconductor-plant-in-assam/#respond Tue, 26 Mar 2024 08:14:57 +0000 https://demo9.thuythu.vn/dx/?p=771 Himanta Biswa Sarma revealed Tata Group’s plan to establish a Rs 40,000 crore semiconductor plant in Assam. After fruitful discussions with the state government, Tata Group has sought the final approval from the Centre, which is anticipated soon.

The conglomerate initiated talks with the state government concerning the semiconductor assembly and packaging plant. Satisfied with the discussions, they’ve approached the Centre for the necessary clearance. Additionally, Tata Group has proposed training 1,000 individuals through the state government for potential employment in the unit.

In August, the state cabinet sanctioned the Assam Semiconductor Manufacturing and Electronic Production Policy to support such ventures. Notably, Jagiroad in Morigaon district is earmarked as the potential location for the plant, situated about 55 km from Guwahati, the state’s largest city.

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South Korean President Yoon Suk Yeol to Strengthen Semiconductor Collaboration with the Netherlands https://demo9.thuythu.vn/dx/south-korean-president-yoon-suk-yeol-to-strengthen-semiconductor-collaboration-with-the-netherlands/ https://demo9.thuythu.vn/dx/south-korean-president-yoon-suk-yeol-to-strengthen-semiconductor-collaboration-with-the-netherlands/#respond Tue, 26 Mar 2024 08:13:59 +0000 https://demo9.thuythu.vn/dx/?p=768 South Korean President Yoon Suk Yeol is set to visit the Netherlands, focusing on strengthening semiconductor collaboration between both chip powerhouse nations. Yoon emphasized the pivotal role of high-tech chips in the global economy, with South Korea contributing 60% of the world’s memory chip supply.

The Netherlands, home to ASML, a key chip-making equipment manufacturer, has a longstanding partnership with South Korea, ensuring stability in global semiconductor supply chains. However, recent geopolitical tensions have led to export restrictions imposed by the U.S., Japan, and now the Netherlands, aimed at limiting China’s access to sensitive technology.

Recognizing the critical significance of the semiconductor industry, Yoon highlighted the visit’s importance amidst growing competition for technological dominance.

Yoon’s trip aims to solidify the semiconductor alliance between South Korea and the Netherlands. He’ll focus on discussions around chip cooperation and seek to establish a comprehensive “chip alliance” involving both countries’ governments, industries, and academia.

With the semiconductor industry facing challenges and supply chain shifts, Yoon intends to establish an institutional framework, enhancing collaboration not only with the Netherlands but also with major countries like the United States and Japan in the semiconductor domain.

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US Department of Commerce Awards $35 Million to BAE Systems for Microelectronics Center Renovation https://demo9.thuythu.vn/dx/us-department-of-commerce-awards-35-million-to-bae-systems-for-microelectronics-center-renovation/ https://demo9.thuythu.vn/dx/us-department-of-commerce-awards-35-million-to-bae-systems-for-microelectronics-center-renovation/#respond Tue, 26 Mar 2024 08:13:14 +0000 https://demo9.thuythu.vn/dx/?p=764 The US Department of Commerce allotted $35 million to BAE Systems to revamp its Microelectronics Center (MEC) in Nashua, New Hampshire, marking the inaugural funding under the CHIPS and Science Act. This initiative aims to fortify US manufacturing, supply chains, and national security, aligning with BAE Systems’ commitment to serving critical missions.

The MEC, a Defense Department-accredited facility, specializes in semiconductor technologies for unique military applications. It stands as a rare domestic hub for six-inch gallium arsenide (GaAs) and gallium nitride (GaN) high-electron-mobility transistor (HEMT) wafer production.

Tom Arseneault, President & CEO of BAE Systems, underscores the funding’s significance in expanding defense programs, strengthening the national supply chain, and fostering technical workforce growth. Collaboration with government entities facilitated this initiative.

Secretary of Commerce Gina Raimondo highlights the Act’s importance in fortifying national security and local economies. This investment in New Hampshire bolsters defense manufacturing, enhancing both security and the state’s economic landscape.

This funding supplements BAE Systems’ ongoing investments, aiming to procure more efficient manufacturing tools, mitigate supply chain risks, and meet burgeoning demands in defense and non-defense sectors like satellite communications and test & measurement equipment.

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Insight Report: Unveiling Growth Trajectories in the Semiconductor Contact Probes Industry. https://demo9.thuythu.vn/dx/insight-report-unveiling-growth-trajectories-in-the-semiconductor-contact-probes-industry/ https://demo9.thuythu.vn/dx/insight-report-unveiling-growth-trajectories-in-the-semiconductor-contact-probes-industry/#respond Mon, 18 Mar 2024 14:22:52 +0000 https://demo9.thuythu.vn/dx/?p=476 LPI’s latest research report, the “Semiconductor Contact Probes Industry Forecast,” delves into global sales analysis from 2022 and projects trends for 2023 to 2029. Providing a detailed breakdown by region, market sector, and sub-sector in US$ millions, the report assesses the Semiconductor Contact Probes market comprehensively.

Examining product segmentation, revenue, market share, company strategies, and M&A activities, this Insight Report offers a thorough analysis of the Semiconductor Contact Probes landscape. It scrutinizes global firms’ strategies, portfolios, market positions, and geographic influence, enhancing understanding of their roles in the burgeoning global market.

The report dissects market trends, drivers, and influencing factors that shape the Semiconductor Contact Probes industry, forecasting insights by type, application, geography, and market size to pinpoint emerging opportunities. Drawing on a detailed methodology and numerous market inputs, this forecast provides a nuanced view of the current state and future trajectory in the Semiconductor Contact Probes market.

Lastly, it presents an overview, market shares, growth opportunities, and key insights into product types, applications, major manufacturers, regions, and countries within the Semiconductor Contact Probes market.

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