Dicing Tape
High levels of uniform expansion, reduces chipping, strong adhesive properties, prevents whiskers, high heat resistance. Precise die separation in semiconductor manufacturing.
Swift Delivery
Small Quantities Welcome
High Quality
Standard specifications
| Item Name | BG/DC | UV/Non-UV | Use | Properties |
| DX-TAD80CN-R | DC | Non-UV | Silicon Wafer | Supports small chips |
| DX-TAD85C-R | DC | UV | Silicon Wafer | Prevents chipping, Supports small chips |
| DX-TAD95C | DC | UV | Silicon Wafer | Transparent, Highly expandable |
| DX-TAD95C-R | DC | UV | Silicon Wafer | Transparent, Highly expandable, RoHS2.0 compliant |
| DXーTAD95C-AS | DC | UV | Silicon Wafer | Transparent, Highly expandable, RoHS2.0 compliant, Antistatic |
| DX-TAU75 | DC | UV | Glass, Ceramic | |
| DXーTAU115 | DC | UV | Glass, Ceramic | |
| DXーTAU125B | DC | UV | Packaging substrates, hard to cut surfaces | Strong adhesive |
| DX-M08P05S | DC | UV | Glass, Si Wafer, SBS, Metal | Low peeling strength after UV |
| DXーTAP100 | DC | UV | Packaging Substrates, Glass | |
| DX-M14P10S | DC | UV | Packaging substrates | Strong adhesive, Prevents chipping |
| DXーTAP165D | DC | UV | Packaging substrates | Strong adhesive, Prevents chipping |
| DXーTAP165EーAS | DC | UV | Package substrates | Strong adhesive, Prevents chipping, Antistatic |
| DXーTAP165 | DC | UV | Packaging Substrates, Glass | |
| DXーTAB165C | DC | UV | Packaging substrates | Prevents chipping, Easily peeled by hand |
| DX-TAB180C | DC | UV | Packaging substrates | Prevents chipping, Good chip peeling by hand |
| DX-TAB180C-A | DC | UV | Packaging substrates | Prevents chipping, Good chip peeling by hand |