Back-Grinding Tape
Strong adhesion to prevent water damage, no adhesive residue keeps adherends clean, especially flat to help with grinding, can be used with uneven surfaces (bump wafers) . Protecting wafers from water damage during back grinding.
Swift Delivery
Small Quantities Welcome
High Quality
Standard specifications
| Item Name | BG/DC | UV/Non-UV | Use | Properties |
| DXーLCP175 | BG | UV | BG standard compatibile | Accuracy, easy to peel |
| DXーLCP180K | BG | UV | BG standard compatibile | High tape thickness, accuracy, easy to peel even for thin film products thanks to UV peeling process |
| DX-LCP130GX | BG | UV | BG standard compatible | Reasonably high tape thickness accuracy, relatively easy to peel even for thin film products thanks to UV peeling process |
| DXーLCP130GNX | BG | NonーUV | BG standard compatibile | General purpose use |
| DXーLCP180LNX | BG | NonーUV | BG standard compatibile | High tape thickness, accuracy、Increased adhesive strength |
| DXーLCP200LNX | BG | NonーUV | BG standard compatibile | High tape thickness |
| DXーLCP290Z | BG | UV | Supports Bump Wafers | Compatible with Bump Wafer |